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BGA stands for Ball Grid Array. A web definition from Princeton, USA explains it as, “A type of memory chip with solder balls on the underside for mounting. Use of BGA allows die package size to be reduced because there is more surface area for attachment. Smaller packaging allows more components to be mounted on a module, making greater densities available. The smaller package also improves heat dissipation for better performance. See CSP and FBGA”.

It is a form of packaging used for electronic circuits that are integrated and surface mounted. The integrated circuits contain components that are actually affixed or mounted to the board of the circuit semiconductor, which is printed. A package of BGA appears like a wafer thin material of semi conductor that contains on one of its faces, the circuit components. This package is named so due to in its basic form; it is an array of balls made of metal alloy arranged in a formation that resembles a grid. Further integrated circuit packaging includes the Pin Grid Array, or PGA. Both appear similar, as both of them are one sided, meaning one of its faces contains substrate for semi conducting, which is used for mounting and printing of the circuit components. The pattern that appears as a grid is also a similarity between them, with the PGA uses pins and the BGA utilizes balls.

BGA manufacture starts of with a printed and primed circuit board, where the pads which are made of copper are arranged in a grid appearing pattern. The solder balls are calculated to have these. Following the precise arrangement of the solder balls upon the printed face of the circuit board’s surface, the process of soldering begins. Mount soldering of the surface proceeds through to reflow soldering, using a reflow oven, which uses vapors or infrared as its heat source. The balls of metal alloy melt because of extreme temperatures, which lead to cooling afterwards. The solder balls then solidify and the package becomes affixed firmly to the circuit board.

BGA’s advantages make the precise mounting and alignment possible. Before BGA came about, single circuit boards required numerous pins, which presented problems in positioning. When the assembly heated up, pins facing each other sometimes soldered together, thereby forming unplanned bridges. Heat conduction is another advantage of BGA over the other packaging types. BGA contains less heat resistance, making it easier for heat to flow to the circuit board that is printed from the components of the mounted circuit. This reduces overheating risks considerably. BGA’s contact points, that is the contact point between the actual circuit board that is printed and the solder balls on the surface is not easily apparent. The actualization of this is greater application and data society.

Some disadvantages of integrated circuits that feature BGA packaging are somewhat inflexible. Rigorous strain upon the integrated circuit can cause the contact tips or the balls to sever off. Moreover, expensive tools would be needed to fix construction or design errors, should they be found.